The following is a list of acronyms and what they stand for:

ACK – Acknowledge
ADC – Analog to Digital Converter
AI – Artificial Intelligence
ALD – Atomic Layer Deposition
ALE – Atomic Layer Etch
AMOLED – Active-Matrix OLED
AMP – Asymmetric Multi Processing
AOI – Automated Optical Inspection
AP – Access Point
ASIC – Application Specific Integrated Circuit
ATE – Automatic Test Equipment
BEOL – Back-End-Of-Line
BGA – Ball Grid Array
BSA – Basic Service Area
BTI – Bias-Temperature Instability
CA – Collision Avoidance
CBRAM – Conductive Bridging RAM
CCI – Cache Coherent Interconnect
CD Collision Detection
CF – Contention-Free
CFP – Contention-Free Period
CP – Contention Period
CPU – Central Processing Unit
CRC – Cyclic Redundancy Check
CSMA – Carrier Sense, Multiple Access
CFD – Computational Fluid Dynamic
CMOS – Complementary Metal Oxide Semiconductor
CNN – Convolutional Neural Network
CPP – Contacted Poly Pitch
CSP – Chip Scale Packaging
CTS – Clear To Send
DAC – Digital to Analog Convertor
DARPA – Defense Advanced Research Projects Agency
DCF – Distributed Coordination Function
DDR – Double Data Rate
DFA – Differential Fault Analysis
DFT – Design for Test
DFM – Design for Manufacturing
DIFS – Distributed Inter-frame Space
DPA – Differential Power Analysis
DL – Deep Learning
DRAM – Dynamic Random Access Memory
DRC – Design Rule Checker
DSA – Directed Self Assembly
DSP – Digital Signal Processor
DUT – Design Under Test
DUV – Design Under Verification
DVFS – Dynamic Voltage and Frequency Scaling
ECO – Engineering Change Order
EDA – Electronic Design Automation
EM – Electromagnetic
EM – Electromigration
ESL – Electronic System Level
EUV – Extreme Ultraviolet
FD-SOI – Fully Depleted Silicon on Insulator
FEOL – Front-End-Of-Line
FET – Field Effect Transistor
FIFO – First In First Out
FPGA – Field Programmable Gate Array
GAA – Gate-All-Around
GaAs – Gallium Arsenide
GaN – Gallium Nitride
GPU – Graphics Processing Unit
HBM – High Bandwidth Memory
HBT – Heterojunction Bipolar Transistor
HDL – Hardware Description Language
HMC – Hybrid Memory Cube
IC – Integrated Circuit
IEEE – Institute of Electrical and Electronics Engineers
IIC – Industrial Internet Consortium
IIoT – Industrial Internet of Things
IoT – Internet of Things
IP – Intellectual Property
IR – Infra-red
ISM – Industrial, Scientific, Medical
ISS – Instruction Set Simulator
ILT – Inverse Lithography Technology
JTAG – Joint Test Action Group
LAN – Local Area Network
LCD – Liquid Crystal Display
LTE – Long-Term Evolution
MAC -Media Access Control
MCU – Microcontroller
MEMS – Micro Electrical Mechanical Systems
MES – Manufacturing Execution Systems
ML-Machine Learning
MOL – Middle-Of-Line
MRAM – Magnetic Random Access Memory
NA – Numerical Aperture
NGL – Next-Generation Lithography
NIC – Network Interface Card
NSF – National Science Foundation
NVM – Non-Volatile Memory
OCAP – Out of Control Action Plan
OLED – Organic Light-Emitting Diode
OPC – Optical Proximity Correction
OS – Operating System
OSAT – Outsourced Semiconductor Assembly and Test
OTP – One Time Programmable
PCB – Printed Circuit Board
PCF – Point Coordination Function
PCM – Phase-Change Memory
PDK – Process Design Kit
PDN – Power Delivery Network
PHY – Physical Layer
PI – Power Integrity
PIFS – Point Inter-frame Space
PnR – Place and Route
PoP – Package-on-Package
PPA – Power, Performance, Area
PPAC – Power, Performance, Area, Cost
PRNG – Pure Random Number Generator
PVT – Process, Voltage, Temperature
RAM – Random Access Memory
RC4 – Rivest Cipher 4
RDL – Register Definition Language
RDL – Redistribution Layer
RF – Radio Frequency
ROM – Read Only Memory
RoT – Root Of Trust
RTL – Register Transfer Level
RTOS – Real Time Operating System
RTS – Request To Send
SCM – Storage Class Memory
SerDes – Serializer / Deserializer
SIFS – Short Inter-frame Space
SI – Signal Integrity
SiC – Silicon Carbide
SiGe – Silicon Germanium
SK – Shared Key
SMP – Symmetric Multi Processing
SoC – System on Chip
SOI – Silicon on Insulator
SPA – Simple Power Analysis
SRAF – Sub-Resolution Assist Features
SRAM – Static Random Access Memory
SSD – Solid-state Storage Drives
SSID – Service Set Identifier
STA – Static Timing Analysis
STI – Shallow Trench Isolation
TLM – Transaction Level Model
TSV – Through Silicon Via
UPF – Unified Power Format
USB – Universal Serial Bus
UVM – Universal Verification Methodology
VHDL – VHSIC Hardware Description Language
VHSIC – Very High Speed Integrated Circuit
VSLI – Very Large Scale Integration
VIP – Verification Intellectual Property
VoWi-Fi – Voice over Wi-Fi
Vt – theshold Voltage
Wan – Wide Area Network
WEP – Wired Equivalency Protocol
Wi-Fi – Wireless High Fidelity
WiGIG – Gigabit Wi-Fi
WLAN – Wireless Local Area Network
WLP – Wafer Level Packaging
WPA – Wi-Fi Protected Access

• Edge Computing

• In-Memory Computing

• Instruction Set Architecture (ISA)

• Near-Memory Computing

• Neuromorphic Computing

• Quantum Computing

• Von Neumann Architecture

• Ambient Intelligence

• Deep Learning (DL)

• Machine Learning (ML)

• Neural Networks

  1. Convolutional Neural Network (CNN)

  2. Generative Adversarial Network (GAN)

  3. Recurrent Neural Network (RNN)

  4. Spiking Neural Network (SNN)

• 
  

• Assisted Driving and Autonomous Vehicles

  1. ADAS: Advanced Driver Assistance Systems

  2. Autonomous Vehicles

• Automotive Architectures

  1. Domain/Distributed Architecture

  2. Software-Defined Vehicles

  3. Zonal Architectures

• Automotive Networking

  1. Automotive Ethernet, Time Sensitive Networking (TSN)

  2. CAN bus

  3. LIN bus

• Automotive Sensors

  1. Lidar: Light Detection And Ranging

  2. Machine Vision

  3. Radar

• Automotive Standards

  1. FlexRay ISO17458

  2. ISO 21434 / SAE 21434 Standard – Automotive cybersecurity

  3. ISO 26262 – Functional safety

  4. ISO/PAS 21448 – SOTIF

  5. UL 4600 – Standard for Safety for the Evaluation of Autonomous Products

Communications

• Communications systems

  • Data processing

  • Open Systems Interconnection model (OSI model)

  • Wired Communications

  • Wireless

• Off-chip communications

  • I/O enabling technology

  • PAM-4 Signaling

  • Silicon Photonics

• On-chip communications

  • Bunch of Wires (BoW)

  • Network on Chip (NoC)

  • Universal Chiplet Interconnect Express (UCIe)

• Automatic Test Pattern Generation (ATPG)

  • Automatic Test Equipment (ATE)

  • PODEM

• Built-in self-test (BiST)

• Cell-Aware Test

  • Cell-Aware Test for FinFET

• Data Analytics

  • Rich Interactive Test Database (RITdb)

  • Standard Test Data Format (STDF)

• Digital Oscilloscope

• Gage R&R, Gage Repeatability And Reproducibility

• Multi-site testing

• Part Average Testing (PAT)

• Power-Aware Test

• Scan Test

• Shmooing, Shmoo test, Shmoo plot

• silent data corruption (SDC)

• Trace

• Wafer Fab Testing

• Definitions

  • A brief history of logic synthesis

  • Analog

  • Chip Design

  • Chip Design and Verification

  • Combinatorial Equivalence Checking

  • Electronic Design Automation (EDA)

  • Guard Banding

  • Layout versus Schematic Checking (LVS)

  • Logic Resizing

  • Logic Restructuring

  • Metastability

  • Mixed-Signal

  • Physical Design

  • PPA (Power, Performance, Area)

  • Printed Circuit Board (PCB)

  • RTL (Register Transfer Level)

• Methodologies and Flows

  • Agile

  • Behavioral Synthesis

  • CDC design principles

  • Design for Manufacturing (DFM)

  • Design for Test (DFT)

  • Electronic System Level (ESL)

  • hardware/software co-design

  • HSA Platform System Architecture Specification

  • HSA Runtime Programmer’s Reference Manual

  • Multi-Corner Multi-Mode (MCMM) Analysis

  • Shift Left

  • Software/Hardware Interface for Multicore/Manycore (SHIM) processors

• Models

  • BSIM

  • Bus Functional Model

  • Hardware Modeler

  • Models and Abstractions

• Noise

  • Avalanche Noise

  • Crosstalk

  • Device Noise

  • Environmental Noise

  • Flicker Noise

  • Generation-Recombination Noise

  • Induced Gate Noise

  • Manufacturing Noise

  • Power Supply Noise

  • Random Telegraph Noise

  • Simultaneous Switching Noise

  • Substrate Noise

  • Thermal Noise

• Verification

  • Checker

  • Clock Domain Crossing (CDC)

  • Coverage

  • Debug

  • Design Rule Checking (DRC)

  • Design Rule Pattern Matching

  • Emulation

  • Fault Simulation

  • Formal Verification

  • Functional Design and Verification

  • Functional Verification

  • Hardware Assisted Verification

  • High-Level Synthesis (HLS)

  • Lint

  • Logic Simulation

  • Physical Verification

  • Processor Utilization

  • Reliability Verification

  • RTL Signoff

  • SAT Solver

  • Scoreboard

  • Simulation

  • Software-Driven Verification

  • Stimulus Constraints

  • Testbench

  • Verification Methodologies

  • Verification Plan

  • Virtual Prototype

  • X Verification

• IC Types

  • Analog circuits

    • MEMS

  • Application Specific Integrated Circuit (ASIC)

  • Application-Specific Standard Product (ASSP)

  • Field Programmable Gate Array (FPGA)

    • Embedded FPGA (eFPGA)

  • Flexible Hybrid Electronics (FHE)

  • Photonic Integrated Circuit (PIC)

  • Power Management IC (PMIC)

  • Power Semiconductors

    • Power Semiconductors Report: A Deep Dive Into Materials, Manufacturing & Business

  • Processors

    • Central Processing Unit (CPU)

    • Digital Signal Processor (DSP)

    • Graphics Processing Unit (GPU)

    • Microcontroller (MCU)

    • Microprocessor, Microprocessor Unit (MPU)

    • Tensor Processing Unit (TPU)

  • Sensors

    • Mote

    • Sensor Fusion

  • System on Chip (SoC)

    • Sensor Signal Conditioner (SSC)

• Transistors

  • 3D Transistors

    • Complementary FET (CFET)

    • FinFET

    • Forksheet FET

    • Gate-All-Around FET (GAA FET)

    • Nanosheet FET

    • Tunnel FET

  • Planar

    • Insulated-Gate Bipolar Transistors (IGBT)

    • Power MOSFETs

• IIoT: Industrial Internet of Things

• Internet of Things (IoT)

• Batteries

• Low Power Verification

• Low-Power Design

  1. Power Consumption

  2. Power Delivery Network (PDN)

  3. Power Estimation

  4. Power-Aware Design

• Power Definitions

• Power Issues

  1. Blech Effect

  2. Electromigration

  3. Electrostatic Discharge (ESD)

  4. Heat Dissipation

  5. IR Drop

  6. Negative Bias Temperature Instability (NBTI)

• Power Management Coverage

• Power Techniques

  1. Chip Thermal Interface Protocol

  2. Clock Gating

  3. Clock Tree Optimization

  4. Dark Silicon

  5. DFT and Clock Gating

  6. Dynamic Voltage and Frequency Scaling (DVFS)

  7. Energy Harvesting

  8. Gate-Level Power Optimizations

  9. Implementation Power Optimizations

  10. Level Shifters

  11. Low Power Methodologies

  12. Multi-Vt

  13. Near Threshold Computing

  14. Operand Isolation

  15. Pin Swapping

  16. Power Cycle Sequencing

  17. Power Gating

  18. Power Isolation

  19. Power Switching

  20. Process Power Optimizations

  21. RTL Power Optimizations

  22. Substrate Biasing

  23. Transition Rate Buffering

  24. Voltage Islands

  25. X Architecture

• 
  

• Fabless Semiconductor Companies

• Foundry, pure-play foundry

• Integrated Device Manufacturer (IDM)

• Lithography

  • E-Beam Lithography

    • Multi-Beam e-Beam Lithography

  • EUV: Extreme Ultraviolet Lithography

    • Stochastics, Stochastic-Induced Defects

  • Impact of lithography on wafer costs

  • Line Edge Roughness (LER)

  • Lithography k1 coefficient

  • Nanoimprint Lithography

  • Optical Lithography

  • Overlay

  • Pellicle

  • Photomask

    • Inverse Lithography Technology (ILT)

    • Optical Proximity Correction (OPC)

  • Photoresist

  • Reticle

  • Shot Noise

• Manufacturing Execution System (MES)

• Original Equipment Manufacturer (OEM)

• Patterning

  • Double Patterning

    • Double Patterning Methodologies

    • Litho Etch Litho Etch (LELE)

    • Litho Freeze Litho Etch

    • Self-Aligned Double Patterning (SADP)

  • Multiple Patterning

  • Triple Patterning

• Process

  • Air Gap

  • Atomic Layer Etch (ALE)

  • Backend-of-the-line (BEOL)

    • Contact

    • Interconnects (BEOL)

  • Deposition

    • Atomic Layer Deposition (ALD)

    • Chemical Vapor Deposition (CVD)

    • Metal Organic Chemical Vapor Deposition (MOCVD)

    • Physical Vapor Deposition (PVD)

  • Directed Self-Assembly (DSA)

  • Epitaxy

  • Failure Analysis

  • Ion Implants

  • Issues

    • Edge Placement Error (EPE)

    • Process Variation

    • Short Channel Effects

  • Metrology

    • Atomic Force Microscopy (AFM), Atomic Force Microscope (AFM)

    • CD-SEM: Critical-Dimension Scanning Electron Microscope

    • Characterization/Metrology Lab

  • Nodes

  • Rapid Thermal Anneal (RTA), Rapid Thermal Processing (RTP)

  • Wafer Inspection

• Yield Management System (YMS)

• Bandgap, Band Gap

• CMOS

• Cobalt

• Compound Semiconductors

  • Gallium Nitride (GaN)

  • Silicon Carbide (SiC)

• Diamond Semiconductors

• Fill

  • Advanced (Smart) Fill

• Fully Depleted Silicon On Insulator (FD-SOI)

• Graphene

• Metamaterials

• MXenes

• Radio Frequency Silicon On Insulator (RF-SOI)

• Rare Earth Elements

• eBook: Memory Fundamentals for Engineers

• Erasable Programmable Read Only Memory (EPROM)

• Error Correction Code (ECC)

• Memory Banking

• Non-Volatile Memory (NVM)

  • Ferroelectric FETs (FeFET)

  • Flash Memory

    • 3D NAND

  • Magnetoresistive RAM (MRAM)

    • Spin-Orbit Torque MRAM (SOT-MRAM)

    • STT-MRAM

  • Phase-Change Memory

  • Resistive RAM (ReRAM/RRAM)

    • ReRAM materials

• One-Time-Programmable Memory (OTP)

• Read Only Memory (ROM)

• Volatile Memory

  • DRAM: Dynamic Random Access Memory

    • High-Bandwidth Memory (HBM)

    • Single transistor DRAM

    • Synchronous DRAM

  • Static Random Access Memory (SRAM)

• Advanced Packaging

  • 2.5D

    • Interposers

  • 3D ICs

    • Monolithic 3D Chips

  • Chiplets

    • Chiplets Research Report: Deep Dive Into Designing, Manufacturing, And Testing

  • Fan-Outs

  • Heterogeneous Integration

  • High-Density Advanced Packaging (HDAP)

  • Molded Interconnect Substrate (MIS)

  • package-on-package (PoP)

  • System In Package (SiP)

    • Multi-chip Modules (MCM)

  • Through-Silicon Vias (TSVs)

• Flip-Chip

• Outsourced Semiconductor Assembly and Test (OSAT)

• Redistribution Layers (RDLs)

• Wirebonding

• Biometrics

  • DNA biometrics

• Crypto processors

• DNA Chips

• Physically Unclonable Functions (PUFs)

• Root of Trust

• Side Channel Attacks

• Zero-Day Vulnerabilities, Attacks

• Application Programming Interface (API)

• Voice control, speech recognition, voice-user interface (VUI)

• Laws

  • Amdahl’s Law

  • Dennard’s Law

  • Koomey’s Law

  • Makimoto’s Wave

  • Metcalfe’s Law

  • Moore’s Law

• Patents

  • Design Patent

  • Inter Partes Review

  • Standard Essential Patent

  • Utility Patent

• Standards

  • Cache Coherent Interconnect for Accelerators (CCIX)

  • Compute Express Link (CXL)

  • De Facto Standards

  • HSA Programmer’s Reference Manual

  • IEEE 1076-VHSIC HW Description Language

  • IEEE 1076.1-Analog & Mixed-Signal

  • IEEE 1076.1.1-VHDL-AMS Standard Packages

  • IEEE 1076.4-VHDL Synthesis Package – Floating Point

  • IEEE 1149 Boundary Scan Test

  • IEEE 1364-Verilog

  • IEEE 1364.1-Verilog RTL Synthesis

  • IEEE 1532- in-system programmability (ISP)

  • IEEE 1647-Functional Verification Language e

  • IEEE 1666-Standard SystemC

  • IEEE 1685-IP-XACT

  • IEEE 1687-IEEE Standard for Access and Control of Instrumentation Embedded

  • IEEE 1800-SystemVerilog

  • IEEE 1800.2–UVM

  • IEEE 1801-Design/Verification of Low-Power, Energy-Aware UPF

  • IEEE 1838: Test Access Architecture for 3D Stacked IC

  • IEEE 1850-Property Specification Language (PSL)

  • IEEE 802.1-Higher Layer LAN Protocols

  • IEEE 802.11-Wireless LAN

  • IEEE 802.15-Wireless Specialty Networks (WSN)

  • IEEE 802.18-Radio Regulatory TAG

  • IEEE 802.19-Wireless Coexistence

  • IEEE 802.22-Wireless Regional Area Networks

  • IEEE 802.3-Ethernet

  • IEEE P2415: Unified HW Abstraction & Layer for Energy Proportional Electronic Systems

  • IEEE P2416-Power Modeling

  • IEEE-ISTO 5001 (Nexus 5001) — embedded processor debug

  • IP-XACT Working Group

  • ISO/SAE FDIS 21434-Road Vehicles — Cybersecurity Engineering

  • SCV SystemC Verification

  • Unified Coverage Interoperability Standard (Verification)

  • Unified HW Abstraction & Layer for Energy Proportional Electronic Systems

  • Unified Power Format (UPF)

  • Verilog-AMS

  • Wide I/O: memory interface standard for 3D IC